February 10. 2022
Topic:
2022 Thermal Interface Material Innovations for Consumer Electronics
Description:
Parker Chomerics have been busy developing new, next generation thermal interface materials specifically to help aid in thermal cooling of consumer electronics devices.
This includes application in products like smart home devices such as control and connectivity, smart appliances, security systems, home entertainment, comfort and lighting and energy management.
Successful thermal management of high-power electronic components (single chips, multi-chip modules, integrated circuits, etc.) with high heat dissipation ratings requires careful design engineering.
In this 2022 Thermal Interface Material Innovations for Consumer Electronics seminar, Parker Chomerics will take you through how to apply these next-generation thermal materials in your application and how they can help solve the design and engineering issues facing the ever-connected consumer electronics devices.
This includes application in products like smart home devices such as control and connectivity, smart appliances, security systems, home entertainment, comfort and lighting and energy management.
Successful thermal management of high-power electronic components (single chips, multi-chip modules, integrated circuits, etc.) with high heat dissipation ratings requires careful design engineering.
In this 2022 Thermal Interface Material Innovations for Consumer Electronics seminar, Parker Chomerics will take you through how to apply these next-generation thermal materials in your application and how they can help solve the design and engineering issues facing the ever-connected consumer electronics devices.
Time:
February 23, 2022 02:00 PM in Eastern Time (US and Canada)
